JPH0737319Y2 - 混成集積回路装置 - Google Patents
混成集積回路装置Info
- Publication number
- JPH0737319Y2 JPH0737319Y2 JP1988122914U JP12291488U JPH0737319Y2 JP H0737319 Y2 JPH0737319 Y2 JP H0737319Y2 JP 1988122914 U JP1988122914 U JP 1988122914U JP 12291488 U JP12291488 U JP 12291488U JP H0737319 Y2 JPH0737319 Y2 JP H0737319Y2
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- hybrid integrated
- insert plate
- substrate
- resin layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 claims description 20
- 229920005989 resin Polymers 0.000 claims description 17
- 239000011347 resin Substances 0.000 claims description 17
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 4
- 230000001105 regulatory effect Effects 0.000 claims description 4
- 230000002093 peripheral effect Effects 0.000 claims description 2
- 230000010354 integration Effects 0.000 description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Multi-Conductor Connections (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988122914U JPH0737319Y2 (ja) | 1988-09-20 | 1988-09-20 | 混成集積回路装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988122914U JPH0737319Y2 (ja) | 1988-09-20 | 1988-09-20 | 混成集積回路装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0244352U JPH0244352U (en]) | 1990-03-27 |
| JPH0737319Y2 true JPH0737319Y2 (ja) | 1995-08-23 |
Family
ID=31371292
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988122914U Expired - Lifetime JPH0737319Y2 (ja) | 1988-09-20 | 1988-09-20 | 混成集積回路装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0737319Y2 (en]) |
-
1988
- 1988-09-20 JP JP1988122914U patent/JPH0737319Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0244352U (en]) | 1990-03-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7706146B2 (en) | Power system module and method of fabricating the same | |
| US6900535B2 (en) | BGA/LGA with built in heat slug/spreader | |
| JPH0737319Y2 (ja) | 混成集積回路装置 | |
| WO2020195834A1 (ja) | 電子装置 | |
| JP2579222Y2 (ja) | 樹脂封止型回路装置 | |
| JPH06112674A (ja) | 電子部品搭載装置用のヒートシンク | |
| JP2612455B2 (ja) | 半導体素子搭載用基板 | |
| JPH0635476Y2 (ja) | 混成集積回路 | |
| JPH0430566A (ja) | 高出力用混成集積回路装置 | |
| CN221994463U (zh) | 一种封装结构 | |
| JPH0623254U (ja) | 基板の固定構造 | |
| JPS6328607Y2 (en]) | ||
| JPH0442939Y2 (en]) | ||
| JPH041738Y2 (en]) | ||
| JPH0731563Y2 (ja) | 混成集積回路のケース材 | |
| JPS614436U (ja) | 半導体装置用パツケ−ジ | |
| JPH0644110Y2 (ja) | 半導体装置 | |
| JPH11191605A (ja) | 電子部品およびその製造方法 | |
| JPH0739244Y2 (ja) | 混成集積回路装置 | |
| JPH0289348A (ja) | 半導体装置 | |
| JPH03129757A (ja) | 熱放散型半導体パッケージ | |
| JPH064582Y2 (ja) | フィルムキャリア | |
| KR200228982Y1 (ko) | 파워 모듈 패키지용 케이스의 구조 | |
| JPH0536296Y2 (en]) | ||
| JP2584086B2 (ja) | 樹脂封止型半導体用パッケージ |